Intertek gives basic safety and effectiveness certification to nationally identified requirements for a wide range of products and solutions. Our product directories permit you to effortlessly verify products that have our marks.
Excessive warmth accelerates don in semiconductors and passive aspects like capacitors. We advocate utilizing thermal imaging during quality checks to identify weak factors prior to assembly. Proper warmth dissipation design and style prevents seventy two% of thermal-connected breakdowns.
By adhering to these finest tactics, engineers can reduce the chance of component failure and Increase the reliability and safety of equipment and techniques.
Temperature extremes: Exposing a component to temperature extremes that could potentially cause product degradation or stress.
By coming to Intertek for failure analysis of your components, our knowledge and practical experience will determine the root reason for failure and present you with the mandatory information necessary for fixing the situation, remedial motion and preventing recurrence.
Automotive engineers diminished guarantee claims by fifty two% after addressing thermal pressure on top of things modules. Our case scientific tests expose how vibration patterns cracked solder joints in motor ECUs—a take care of requiring specialized mounting and conformal coatings.
Intertek’s crew of Complete Quality Assurance industry experts has several years of expertise in carrying out failure analysis on components in engineering machines, made items and plant infrastructure.
They serve all industries that have a component failure and our buyers have involved aerospace, bicycle and clinical implants brands and corporations linked to major engineering.
Assurance Enabling you to determine and mitigate the intrinsic danger as part of your functions, provide chains and top quality management systems.
Faulty packaging invites environmental attacks. Cracked IC casings Allow moisture corrode gold bond wires. component failure analysis Dust infiltration shorts MEMS sensors in industrial controllers. Appropriate sealing exams in the course of incoming inspections catch these vulnerabilities early.
Fault tree analysis: Developing a diagram that displays the possible brings about of failure and the associations concerning them.
Dye penetrant tests exposes hairline cracks in non-metallic surfaces. Magnetic particle scans obtain subsurface defects in metal relays.
Ansys Sherlock presently performs this analysis for ceramic and electrolytic capacitors. The techniques utilized for electrolytic capacitors are seller-dependent dependant on equations supplied by supported suppliers.
Not all Digital issues announce themselves—some erode efficiency slowly right up until devices collapse. We establish 4 Key culprits at the rear of these silent breakdowns to help you strengthen your quality controls.